Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test

• 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
• 作者Sung Yi, ; Jing Sua Goh, ; Ji Cheng Yang,
• 卷第20卷
• 期第3期
• 印刷ISSN1070-9894
• 文件大小196.03KB
• 发表时间1997
• DOI10.1109/96.618224
• 页码247-255