Effect of cracks on thermal stress and strain of a tape automated bonded package
- 作者C.M.L. Wu; J.K.L. Lai; Yongli Wu
- 卷第38卷
- 印刷ISSN0263-8223
- 文件大小591.17KB
- 发表时间1997
- DOI10.1016/s0263-8223(97)00088-3
- 页码525-530
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