ChemInform Abstract: Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration.
V. M. DUBIN; Y. SHACHAM-DIAMAND; B. ZHAO; P. K. VASUDEV; C. H. TING
- 作者V. M. DUBIN; Y. SHACHAM-DIAMAND; B. ZHAO; P. K. VASUDEV; C. H. TING
- 卷第28卷
- 期第26期
- 印刷ISSN0931-7597
- 电子ISSN1522-2667
- 文件大小26.05KB
- 发表时间1997
- DOI10.1002/chin.199726278