Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening

Mendez, S.; Andreasen, G.; Schilardi, P.; Figueroa, M.; Vázquez, L.; Salvarezza, R. C.; Arvia, A. J.

期刊名称Langmuir
作者Mendez, S.; Andreasen, G.; Schilardi, P.; Figueroa, M.; Vázquez, L.; Salvarezza, R. C.; Arvia, A. J.
卷第14卷
期第9期
印刷ISSN0743-7463
电子ISSN1520-5827
文件大小288.49KB
发表时间1998-04
DOI10.1021/la970362t
页码2515-2524

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