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Metal diffusion in polymersDas, J.H.; Morris, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1994
Multiconductor transmission line characterizationWilliams, D.F. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1997
TBGA package technologyAndros, F.E.; Hammer, R.B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1994
Electrical performance of microwave boardsTraut, G.R. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1995
Editor's statementKrusius, J. Peter · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1998
[Back cover]IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1998
[Advertisement]IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1998
[Back inside cover]IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1998