[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Statistics of microstructure for via metallization and implication for electromigration reliability
- 作者Toyoda, H.; Wang, P.-H.; Ho, P.S.
- 文件大小539.84KB
- 发表时间1998
- DOI10.1109/relphy.1998.670664
- 页码324-328
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