[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Dynamics of backside wafer level microprobing
- 作者Chiang, C.-L.; Hurley, D.T.
- 文件大小3204.13KB
- 发表时间1998
- DOI10.1109/relphy.1998.670465
- 页码137-149
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