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[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - A new concept for using of Al-sheet as integrated substrate for one or multichip module package

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - A new concept for using of Al-sheet as integrated substrate for one or multichip module package

Philippov, Ph.; Arnaudov, R.; Yordanov, N.; Gospodinova, M.
  • 作者Philippov, Ph.; Arnaudov, R.; Yordanov, N.; Gospodinova, M.
  • 文件大小495.74KB
  • 发表时间1998
  • DOI10.1109/icmcm.1998.670764
  • 页码112-117
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