[IEEE 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual - Reno, NV, USA (1998.03.31-1998.04.2)] 1998 IEEE International Reliability Physics Symposium Proceedings 36th Annual (Cat No 98CH36173) RELPHY-98 - Chip scale package (CSP) solder joint reliability and modeling
- 作者Amagai, M.
- 文件大小1251.46KB
- 发表时间1998
- DOI10.1109/relphy.1998.670560
- 页码260-268
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