Studying electro‐physical material characteristics of vacuum‐deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups
- 期刊名称Microelectronics International
- 作者Philippov, Ph.; Arnaudov, R.; Yordanov, N.; Ianev, V.; Gospodinova, M.
- 卷第15卷
- 期第3期
- 印刷ISSN1356-5362
- 文件大小85.71KB
- 发表时间1998-12
- DOI10.1108/13565369810233131
- 页码31-35
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