Simulation of transients in VLSI packaging interconnectionsPalusinski, O.A.; Liao, J.C.; Prince, J.L.; Cangellaris, A.C. · 1990

Analysis of conductor losses in high-speed interconnectsvan Deventer, T.E.; Katehi, L.P.B.; Cangellaris, A.C. · 1994

An automated and efficient substrate noise analysis toolHongmei Li; Zemke, C.E.; Manetas, G.; Okhmatovski, V.I.; Rosenbaum, E.; Cangellaris, A.C. · 2006

Time-domain finite methods for electromagnetic wave propagation and scatteringCangellaris, A.C. · 1991

S-parameter analysis of multiconductor, integrated circuit interconnect systemsCooke, B.J.; Prince, J.L.; Cangellaris, A.C. · 1992

A new finite element model for reduced order electromagnetic modelingYu Zhu, ; Cangellaris, A.C. · IEEE Microwave and Wireless Components Letters · 2001

Evaluation of layered media Green's functions via rational function fittingOkhmatovski, V.I.; Cangellaris, A.C. · 2004