[IEEE 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual - San Diego, CA, USA (23-25 March 1999)] 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296) - Surface electromigration in copper interconnects
- 作者McCusker, N.D.; Gamble, H.S.; Armstrong, B.M.
- 文件大小878.18KB
- 发表时间1999
- DOI10.1109/relphy.1999.761625
- 页码270-276
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