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Characterization of organic solution deposited copper seed layers on Al(Cu) sputtered thin films

Characterization of organic solution deposited copper seed layers on Al(Cu) sputtered thin films

M. J. O’keefe; K. D. Leedy; J. T. Grant; M. Fang; H. Gu; T. J. O’keefe

作者M. J. O’keefe; K. D. Leedy; J. T. Grant; M. Fang; H. Gu; T. J. O’keefe
文件大小1015.87KB
发表时间1999
DOI10.1116/1.590920

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