High frequency wire bonding for PBGA package, a process optimisation approach
- 期刊名称Microelectronics International
- 作者Kiat Choon, Teo; Corpuz, Victor G.
- 卷第16卷
- 期第3期
- 印刷ISSN1356-5362
- 文件大小268.89KB
- 发表时间1999-12
- DOI10.1108/13565369910293314
- 页码22-35
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