[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Study on surface tension and adhesion in electronic packaging
Shijian Luo, ; Vidal, M.; Wong, C.P.
- 作者Shijian Luo, ; Vidal, M.; Wong, C.P.
- 文件大小636.99KB
- 发表时间2000
- DOI10.1109/ectc.2000.853218
- 页码586-591