Innovative ESD thermoplastic composites structured through melt flow processing

• 期刊名称IEEE Transactions on Electronics Packaging Manufacturing
• 作者Narkis, M.; Lidor, G.; Vaxman, A.; Zuri, L.
• 卷第23卷
• 期第4期
• 印刷ISSN1521-334X
• 文件大小13.57KB
• 发表时间2000-10
• DOI10.1109/tepm.2000.895052
• 页码235-235