Soft solder die bonding of multiple die devices
- 期刊名称IEEE Transactions on Components and Packaging Technologies
- 作者Luechinger, C.; Kellenberger, D.; Radeck, S.
- 卷第23卷
- 期第4期
- 印刷ISSN1521-3331
- 文件大小616.49KB
- 发表时间2000
- DOI10.1109/6144.888848
- 页码646-656
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