Lead‐free reflow soldering for electronics assembly
- 期刊名称Soldering & Surface Mount Technology
- 作者Harrison, M.R.; Vincent, J.H.; Steen, H.A.H.
- 卷第13卷
- 期第3期
- 印刷ISSN0954-0911
- 文件大小1466.89KB
- 发表时间2001-12
- DOI10.1108/09540910110407388
- 页码21-38
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