On the applicability of the GOK model for TSC relaxation
- 期刊名称IEEE Transactions on Dielectrics and Electrical Insulation
- 作者Mandowski, A.; Swiatek, J.
- 卷第8卷
- 期第3期
- 印刷ISSN1070-9878
- 文件大小221.57KB
- 发表时间2001-6
- DOI10.1109/94.933366
- 页码469-471
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