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Atomic-Layer Cleaving and Non-contact Thinning and Thickening for Fabrication of Laminated Electronic and Photonic Materials

Atomic-Layer Cleaving and Non-contact Thinning and Thickening for Fabrication of Laminated Electronic and Photonic Materials

Current, Michael I.; Farrens, Shari N.; Fuerfanger, Martin; Kang, Sien; Kirk, Harry R.; Malik, Igor J.; Feng, Lucia; Henley, Francois J.
  • 期刊名称MRS Proceedings
  • 作者Current, Michael I.; Farrens, Shari N.; Fuerfanger, Martin; Kang, Sien; Kirk, Harry R.; Malik, Igor J.; Feng, Lucia; Henley, Francois J.
  • 卷第681卷
  • 电子ISSN1946-4274
  • 文件大小717.68KB
  • 发表时间2001-1
  • DOI10.1557/proc-681-i8.3
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