Thermal simulation of switchgear
- 期刊名称IEEE Transactions on Components and Packaging Technologies
- 作者Paulke, J.; Weichert, H.; Steinhaeuser, P.
- 卷第25卷
- 期第3期
- 印刷ISSN1521-3331
- 文件大小799.54KB
- 发表时间2002-09
- DOI10.1109/tcapt.2002.804608
- 页码434-439
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