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Plasma molding over surface topography: Simulation of ion flow, and energy and angular distributions over steps in RF high-density plasmas

Plasma molding over surface topography: Simulation of ion flow, and energy and angular distributions over steps in RF high-density plasmas

Doosik Kim, ; Economou, D.J.
  • 期刊名称IEEE Transactions on Plasma Science
  • 作者Doosik Kim, ; Economou, D.J.
  • 卷第30卷
  • 期第5期
  • 印刷ISSN0093-3813
  • 文件大小592.96KB
  • 发表时间2002-10
  • DOI10.1109/tps.2002.805326
  • 页码2048-2058
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