Plasma molding over surface topography: Simulation of ion flow, and energy and angular distributions over steps in RF high-density plasmas
Doosik Kim, ; Economou, D.J.
- 期刊名称IEEE Transactions on Plasma Science
- 作者Doosik Kim, ; Economou, D.J.
- 卷第30卷
- 期第5期
- 印刷ISSN0093-3813
- 文件大小592.96KB
- 发表时间2002-10
- DOI10.1109/tps.2002.805326
- 页码2048-2058