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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI

Sunohara, M.; Fujii, T.; Hoshino, M.; Yonemura, H.; Tomisaka, M.; Takahashi, K.

作者Sunohara, M.; Fujii, T.; Hoshino, M.; Yonemura, H.; Tomisaka, M.; Takahashi, K.
文件大小964.14KB
发表时间2002
DOI10.1109/ectc.2002.1008100
页码238-245

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