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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Fundamental adhesion issues for advanced flip chip packaging

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Fundamental adhesion issues for advanced flip chip packaging

Tong, Q.; Ma, B.; Xiao, A.; Savoca, A.; Shijian Luo, ; Wong, C.P.

作者Tong, Q.; Ma, B.; Xiao, A.; Savoca, A.; Shijian Luo, ; Wong, C.P.
文件大小768.08KB
发表时间2002
DOI10.1109/ectc.2002.1008285
页码1373-1379

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