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Influences of Hydrogen on the Evolution of the Electrical Resistivity Of Ultra-Thin Sputtered Copper Films Measured in Real-Time

Influences of Hydrogen on the Evolution of the Electrical Resistivity Of Ultra-Thin Sputtered Copper Films Measured in Real-Time

Barnat, E. V.; Wang, P. -I.; Nagakura, D.; Lu, T. -M.

期刊名称MRS Proceedings
作者Barnat, E. V.; Wang, P. -I.; Nagakura, D.; Lu, T. -M.
卷第721卷
电子ISSN1946-4274
文件大小233.84KB
发表时间2002
DOI10.1557/PROC-721-J3.6

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