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Characterization of Via Etching in CHF
<sub/>3</sub>
/CF
<sub/>4</sub>
Magnetically Enhanced Reactive Ion Etching Using Neural Networks

Characterization of Via Etching in CHF ₃ /CF ₄ Magnetically Enhanced Reactive Ion Etching Using Neural Networks

Kwon, Sung Ku Kwon; Kwon, Kwang Ho Kwon; Kim, Byung Whan Kim; Park, Jong Moon Park; Yoo, Seong Wook Yoo; Park, Kun Sik Park; Kyu, Yoon Kyu

期刊名称ETRI Journal
作者Kwon, Sung Ku Kwon; Kwon, Kwang Ho Kwon; Kim, Byung Whan Kim; Park, Jong Moon Park; Yoo, Seong Wook Yoo; Park, Kun Sik Park; Kyu, Yoon Kyu
卷第24卷
期第3期
印刷ISSN1225-6463
文件大小388.49KB
发表时间2002-06-01
DOI10.4218/etrij.02.0102.0305
页码211-220

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