Surface property of passivation layer on integrated circuit chip and solder mask layer on printed circuit board
- 期刊名称IEEE Transactions on Electronics Packaging Manufacturing
- 作者Luo, S.; Wong, C.P.
- 卷第26卷
- 期第4期
- 印刷ISSN1521-334X
- 文件大小491.62KB
- 发表时间2003-10
- DOI10.1109/TEPM.2003.822996
- 页码345-351
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