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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachining

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Stress characterization of electroplated gold layers for low temperature surface micromachining

Margesin, B.; Bagolini, A.; Guarnieri, V.; Giacomozzi, F.; Faes, A.; Pal, R.; Decarli, M.

作者Margesin, B.; Bagolini, A.; Guarnieri, V.; Giacomozzi, F.; Faes, A.; Pal, R.; Decarli, M.
文件大小262.42KB
发表时间2003
DOI10.1109/DTIP.2003.1287077
页码402-405

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