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[IEEE Comput. Soc ISQED 2003: 4th International Symposium on Quality Electronic Design - San Jose, CA, USA (24-26 March 2003)] Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. - Active device under bond pad to save I/O layout for high-pin-count SOC

[IEEE Comput. Soc ISQED 2003: 4th International Symposium on Quality Electronic Design - San Jose, CA, USA (24-26 March 2003)] Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. - Active device under bond pad to save I/O layout for high-pin-count SOC

Ming-Dou Ker, ; Jeng-Jie Peng, ; Hsin-Chin Jiang,

作者Ming-Dou Ker, ; Jeng-Jie Peng, ; Hsin-Chin Jiang,
文件大小476.37KB
发表时间2003
DOI10.1109/isqed.2003.1194738
页码241-246

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