Electrical characterization of the copper cmp process and derivation of metal layout rules

• 期刊名称IEEE Transactions on Semiconductor Manufacturing
• 作者Lakshminarayanan, S.; Wright, P.J.; Pallinti, J.
• 卷第16卷
• 期第4期
• 印刷ISSN0894-6507
• 文件大小684.79KB
• 发表时间2003-11
• DOI10.1109/tsm.2003.818956
• 页码668-676