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The interplay between geometry, electronic structure, and reactivity of Cu-Ni bimetallic (111) surfaces

The interplay between geometry, electronic structure, and reactivity of Cu-Ni bimetallic (111) surfaces

G. Held

作者G. Held
卷第76卷
期第5期
印刷ISSN0947-8396
电子ISSN1432-0630
文件大小1503.78KB
发表时间2003-03
DOI10.1007/s00339-002-2005-4
页码689-700

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