发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

The role of water in delamination in electronic packages: degradation of interfacial adhesion

The role of water in delamination in electronic packages: degradation of interfacial adhesion

Leung, S.Y.Y.; Lam, D.C.C.; Luo, Shijian; Wong, C.P.

期刊名称Journal of Adhesion Science and Technology
作者Leung, S.Y.Y.; Lam, D.C.C.; Luo, Shijian; Wong, C.P.
卷第18卷
期第10期
印刷ISSN0169-4243
电子ISSN1568-5616
文件大小450.34KB
发表时间2004-01
DOI10.1163/1568561041581306
页码1103-1121

← 返回【学霸图书馆】主页