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[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - GHz flip chip interconnect experiments

[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - GHz flip chip interconnect experiments

Boustedt, K.; Karnfelt, C.

作者Boustedt, K.; Karnfelt, C.
文件大小2023.44KB
发表时间2004
DOI10.1109/isapm.2004.1288025
页码267-271

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