Electrochemical Treatment of Simulated Copper CMP Wastewater Using Boron Doped Diamond Thin Film Electrodes—A Feasibility Study
Tamilmani, S.; Huang, W.H.; Raghavan, S.; Farrell, J.
- 期刊名称IEEE Transactions on Semiconductor Manufacturing
- 作者Tamilmani, S.; Huang, W.H.; Raghavan, S.; Farrell, J.
- 卷第17卷
- 期第3期
- 印刷ISSN0894-6507
- 文件大小637.14KB
- 发表时间2004-08
- DOI10.1109/tsm.2004.831528
- 页码448-454