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Electrochemical Treatment of Simulated Copper CMP Wastewater Using Boron Doped Diamond Thin Film Electrodes—A Feasibility Study

Electrochemical Treatment of Simulated Copper CMP Wastewater Using Boron Doped Diamond Thin Film Electrodes—A Feasibility Study

Tamilmani, S.; Huang, W.H.; Raghavan, S.; Farrell, J.
  • 期刊名称IEEE Transactions on Semiconductor Manufacturing
  • 作者Tamilmani, S.; Huang, W.H.; Raghavan, S.; Farrell, J.
  • 卷第17卷
  • 期第3期
  • 印刷ISSN0894-6507
  • 文件大小637.14KB
  • 发表时间2004-08
  • DOI10.1109/tsm.2004.831528
  • 页码448-454
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