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[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - Predicting the strength of underfill/polyimide interfaces

[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - Predicting the strength of underfill/polyimide interfaces

Pearson, R.A.; Oldak, R.

作者Pearson, R.A.; Oldak, R.
文件大小1389.84KB
发表时间2004
DOI10.1109/isapm.2004.1288024
页码264-266

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