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[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder balls

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder balls

Law, C.M.T.; Wu, C.M.L.
  • 作者Law, C.M.T.; Wu, C.M.L.
  • 文件大小1168.53KB
  • 发表时间2004
  • DOI10.1109/hpd.2004.1346674
  • 页码60-65
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