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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - A monolithic, compact balun/matching network for SiP applications

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - A monolithic, compact balun/matching network for SiP applications

Frye, R.C.; Badakere, G.; Lin, Y.; Chelvam, P.

作者Frye, R.C.; Badakere, G.; Lin, Y.; Chelvam, P.
文件大小240.87KB
发表时间2004
DOI10.1109/epep.2004.1407540
页码37-40

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