[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Microstructure evolution and shear strength of eutectic Sn-9Zn and Sn-0.7Cu lead-free BGA solder balls

• 作者Wu, C.M.L.; Law, C.M.T.
• 文件大小1368.55KB
• 发表时间2004
• DOI10.1109/hpd.2004.1346672
• 页码47-51