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[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - Void free processing of flip chip on board assemblies using no-flow underfills

[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - Void free processing of flip chip on board assemblies using no-flow underfills

Colella, M.; Baldwin, D.

作者Colella, M.; Baldwin, D.
文件大小2520.86KB
发表时间2004
DOI10.1109/isapm.2004.1288026
页码272-281

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