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[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow

Hu Guojun, ; Tay, A.A.O.

作者Hu Guojun, ; Tay, A.A.O.
文件大小357.40KB
发表时间2004
DOI10.1109/eptc.2004.1396585
页码98-104

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