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[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Power supply noise-aware 3D floorplanning for system-on-package

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Power supply noise-aware 3D floorplanning for system-on-package

Eric Wong, ; Minz, J.; Sung Kyu Lim,

作者Eric Wong, ; Minz, J.; Sung Kyu Lim,
文件大小995.80KB
发表时间2005
DOI10.1109/epep.2005.1563753
页码259-262

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