[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Nanoreliability-combined simulation and testing

• 作者Michel, B.
• 文件大小481.23KB
• 发表时间2005
• DOI10.1109/esime.2005.1502759
• 页码3-5