发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

Hu Guojun, ; Tay, A.A.O.

作者Hu Guojun, ; Tay, A.A.O.
卷第2卷
文件大小411.91KB
发表时间2005
DOI10.1109/ectc.2005.1441263
页码172-178

← 返回【学霸图书馆】主页