发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Thermal and Crosstalk-Aware Physical Design for 3D System-On-Package

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Thermal and Crosstalk-Aware Physical Design for 3D System-On-Package

Minz, J.; Wong, E.; Sung Kyu Lim,

作者Minz, J.; Wong, E.; Sung Kyu Lim,
卷第2卷
文件大小350.04KB
发表时间2005
DOI10.1109/ectc.2005.1441368
页码824-831

← 返回【学霸图书馆】主页