[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Vision based Integrated System for Automated Anodic Bonding of MEMS Sensors
Sun Lining, ; Xie Hui, ; Rong Weibin, ; Chen Liguo,
- 作者Sun Lining, ; Xie Hui, ; Rong Weibin, ; Chen Liguo,
- 文件大小365.19KB
- 发表时间2005
- DOI10.1109/icept.2005.1564719
- 页码1-5