Electron backscattered diffraction analysis of copper damascene interconnect for ultralarge-scale integration
- 作者Hyo-Jong Lee; Dong Ik Kim; Jeong Hun Ahn; Dong Nyung Lee
- 卷第474卷
- 印刷ISSN0040-6090
- 文件大小512.57KB
- 发表时间2005
- DOI10.1016/j.tsf.2004.08.141
- 页码250-254
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