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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Reliability prediction in electronic packages using molecular simulation

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Reliability prediction in electronic packages using molecular simulation

Fan, H.B.; Wong, C.K.Y.; Yuen, M.M.F.

作者Fan, H.B.; Wong, C.K.Y.; Yuen, M.M.F.
卷第2卷
文件大小315.28KB
发表时间2005
DOI10.1109/ectc.2005.1441438
页码1314-1317

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