Condition Monitoring Using a Latent Process Model with an Application to Sheet Metal Stamping Processes
- 期刊名称Journal of Manufacturing Science and Engineering
- 作者Li, Xiaoli; Du, R.
- 卷第127卷
- 期第2期
- 印刷ISSN1087-1357
- 文件大小722.20KB
- 发表时间2005
- DOI10.1115/1.1870015
Engineering of Superconductive CeramicsRokhvarger, Anatoly E.; Chigirinsky, Lubov A. · Journal of Electronic Packaging · 2004
Electromigration Simulation for Metal LinesJing, JianPing; Liang, Lihua; Meng, Guang · Journal of Electronic Packaging · 2010
Various Adhesives for Flip ChipsZhong, Z. W. · Journal of Electronic Packaging · 2005
Constriction Resistance in Rectangular BodiesKrane, Matthew John M. · Journal of Electronic Packaging · 1991
Thermal Phenomena in Nanoscale TransistorsPop, Eric; Goodson, Kenneth E. · Journal of Electronic Packaging · 2006
Uniform Channel Micro Heat ExchangersYin, X.; Bau, H. H. · Journal of Electronic Packaging · 1997
Thermal Stresses in Compliantly Joined MaterialsGlaser, J. C. · Journal of Electronic Packaging · 1990
Deformation in Multilayer Stacked AssembliesPan, Tsung-Yu; Pao, Yi-Hsin · Journal of Electronic Packaging · 1990