Reliability assessment for SnPb solder and Ag‐Pd bond pad metallization
- 期刊名称Microelectronics International
- 作者Choon Teo, Kiat; Lin Ting, Yu
- 卷第22卷
- 期第2期
- 印刷ISSN1356-5362
- 文件大小667.60KB
- 发表时间2005-08
- DOI10.1108/13565360510592199
- 页码21-27
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