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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - High Precision Young’s Modulus Extraction of Thin Films Through Measuring the Electric-Circuit Behavior of Microstructures

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - High Precision Young’s Modulus Extraction of Thin Films Through Measuring the Electric-Circuit Behavior of Microstructures

Hu, Yuh-Chung; Gau, Wei-Hsin; Tu, Wei-Hsiang
  • 作者Hu, Yuh-Chung; Gau, Wei-Hsin; Tu, Wei-Hsiang
  • 文件大小111.78KB
  • 发表时间2005
  • DOI10.1115/IPACK2005-73337
  • 页码1743-1747
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